A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...