中国のテンセントは、AIを活用した3Dアセット生成エンジン「Hunyuan 3D creation engine」をグローバル展開しています。発表は2025年11月26日に行われています。本エンジンは、3Dアセット生成に […] ...
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既存の2D半導体から大幅な性能向上が期待できる「3Dチップ」の製造 ...
これまでのように平面上へパーツを敷き詰めた半導体ではなく、パーツの層を縦に積み上げた「3Dチップ」が開発されました。これにより、従来の「2Dチップ」と比較してスループットが4倍向上するなど大幅な改善が見られたとのことです。
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